Diamond Inner Blades for Semi-Conductive Materials...

Diamond Inner Blades are used to slice silicon ingots and other semi-conductive materials with a high degree of accuracy.

The blades have been developed to accommodate increasingly larger wafer sizes and are also used to slice Glass, Ceramics, and Other hard materials

Place of Origin: Henan in China
Brand Name: CPC
Payment Terms: L/C,T/T(Bank Transfer),

Diamond Inner Blades for Semi-Conductive Materials...